Qiangqiang Sun, Yujuan Dong,Zenglin Wang*, Shiwei Yin*, Chuan Zhao*. Synergistic nanotubular copper-doped nickel catalysts for hydrogen evolution reactions.Small,2018, 1704137.

Xiaoshan Su, Qiangqiang Sun, Jingjing Bai,Zenglin Wang*, Chuan Zhao*. Electrodeposition of porous MoO₄^2--doped NiFe nanosheets for highly efficient electrocatalytic oxygen evolution reactions.Electrochimica Acta,2018, 260, 477.

Zhanwu Lei, Jingjing Bai, Yibing Li,Zenglin Wang*, Chuan Zhao*. Fabrication of nanoporous nickel–iron hydroxylphosphate composite as bifunctional and reversible catalyst for highly efficient intermittent water splitting.ACS Appl. Mater. Interfaces,2017, 9(41), 35837.

Jingjing Bai, Qiangqiang Sun,Zenglin Wang*, Chuan Zhao*. Electrodeposition of cobalt nickel hydroxide composite as a high-efficiency catalyst for hydrogen evolution reactions.J. Electrochem. Soc.2017, 164 (9), H587

Chun Chang, Xubin Lu, Zhanwu Lei,Zenglin Wang*, Chuan Zhao*.2-Mercaptopyridine as a new leveler for bottom-up filling of micro-vias in copper electroplating.Electrochimica Acta,2016, 208, 33.

Chun Chang, Zhanwu Lei, Yuhan Li, andZenglin Wang*.Electrochemical research of a stable electroless silver bath.J. Electrochem. Soc.,2016, 163(3), D121.

Zhanwu Lei, Long Chen, Wenliang Wang,Zenglin Wang*, Chuan Zhao*.Tetrazolederivedlevelers forfillingelectroplated Cumicrovias:electrochemicalbehaviors andquantumcalculations.Electrochimica Acta,2015, 178, 546.

Yuhan Li, Qi Qiang, Xingwang Zheng,Zenglin Wang^*.Controllable electrochemical synthesis of Ag nanoparticles in ionicliquid microemulsions.Electrochem.Comm.,2015,58,41.

Wenxia Zhao, Jie Ding, andZenglin Wang*. Improvement in the etching performance of the acrylonitrile−butadiene−styrene resin by MnO₂-H₃PO₄-H₂SO₄colloid.Langmuir,2013, 29, 5968.

Zhifeng Yang, Xu Wang, Na Li, Zhixiang Wang, andZenglin Wang*.Design and achievement of a complete bottom-up electroless copper filling for sub-micrometer trenches.Electrochimica Acta,2011,56 (9)3317. 1981-1988